{"title":"低成本多芯片模块基于单面和双面芯片板上模块遵循Jedec标准规范","authors":"P. Clot","doi":"10.1109/IEMT.1993.398161","DOIUrl":null,"url":null,"abstract":"The author explains how two original designs using chip-on-board technology have been completed and pushed into production. Both are made on the same kind of modified multilayer glass epoxy. One is equipped with J lead output pins, allowing the mounting of silicon dice on both faces of the printed circuit board; the second supports dice on the top only, the bottom face being reserved for direct surface mount device (SMD) soldering carefully prepared for this purpose. Design rules, dimensions regarding Jedec standard, mounting procedures as well as qualification program and test approach are described. Considerations on the choice of dice epoxy coatings are explained. Dispensing and machining are defined to allow pick and place handling by automatic machine.<<ETX>>","PeriodicalId":206206,"journal":{"name":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","volume":"22 2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1993-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Low cost multi-chip modules based on single and double sided chip-on-board modules following Jedec standard specifications\",\"authors\":\"P. Clot\",\"doi\":\"10.1109/IEMT.1993.398161\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The author explains how two original designs using chip-on-board technology have been completed and pushed into production. Both are made on the same kind of modified multilayer glass epoxy. One is equipped with J lead output pins, allowing the mounting of silicon dice on both faces of the printed circuit board; the second supports dice on the top only, the bottom face being reserved for direct surface mount device (SMD) soldering carefully prepared for this purpose. Design rules, dimensions regarding Jedec standard, mounting procedures as well as qualification program and test approach are described. Considerations on the choice of dice epoxy coatings are explained. Dispensing and machining are defined to allow pick and place handling by automatic machine.<<ETX>>\",\"PeriodicalId\":206206,\"journal\":{\"name\":\"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium\",\"volume\":\"22 2 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1993-10-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.1993.398161\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1993.398161","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Low cost multi-chip modules based on single and double sided chip-on-board modules following Jedec standard specifications
The author explains how two original designs using chip-on-board technology have been completed and pushed into production. Both are made on the same kind of modified multilayer glass epoxy. One is equipped with J lead output pins, allowing the mounting of silicon dice on both faces of the printed circuit board; the second supports dice on the top only, the bottom face being reserved for direct surface mount device (SMD) soldering carefully prepared for this purpose. Design rules, dimensions regarding Jedec standard, mounting procedures as well as qualification program and test approach are described. Considerations on the choice of dice epoxy coatings are explained. Dispensing and machining are defined to allow pick and place handling by automatic machine.<>
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