MOS集成电路中降低泄漏功率的最新方法综述

Veena Upadhyay, Puran Gour, B. B. Soni
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引用次数: 3

摘要

今天,集成电路的功能随着其中晶体管数量的增加而日益增加。然而,晶体管的缩小会增加其数量,对于相同面积的集成电路,其亚阈值电压会随着泄漏功耗的增加而降低。在不同的尺度(45 nm, 60 nm, 90 nm等)缩放导致电路的静态和动态相位的主要损失。功耗是基于元件的数量及其制造[14]及其在集成电路中的方向和连接。根据ITRS[1]的报告,这是当今任何VLSI电路设计人员的主要因素。为了降低泄漏功耗,采用了堆栈[3]、[6]、休眠堆栈[11]、[12]、休眠守护器[3]、带堆栈的泄漏反馈[6]等技术,但代价是延迟和面积损失。在这里,我们回顾了所有不同的方法,这些方法克服了关键参数,如面积和延迟惩罚,在更大程度上提高了性能和密度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A survey on recent approaches for leakage power reduction in MOS integrated circuit
Today the integrated circuit's functionalities are increasing day by day with increase in the number of transistors in it. However, the scaling of the transistors, top increase its number, for the same area of an IC reduces its sub-threshold voltage with its increase in the leakage power consumption. Scaling at different scales (45 nm, 60 nm, 90 nm etc.) leads to major losses both at static and dynamic phase of the circuits. The Power consumption is based on the number of elements and its fabrication [14] with its orientation and connections in an integrated circuit. It is the dominant factor in today's scenario for any VLSI circuit designer as per reported by ITRS [1]. Different techniques such as stack [3], [6], sleepy stack [11], [12], sleepy keeper [3], leakage feedback with stack [6] etc., were developed to reduce leakage power consumption at the cost of delay and area penalty. Here we make a review of all the different approaches which has overcome the critical parameters such as area and delay penalty with high performance and increased density to greater extent.
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