在考虑热现象的COB情况下对功率led进行建模

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI:10.23919/EMPC.2017.8346884

K. Górecki, Przemysław Ptak

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引用次数: 0

摘要

本文在SPICE软件中对功率发光二极管(led)进行了考虑热现象的建模。文中给出了该二极管的光电模型，并对该模型的正确性进行了实验验证。对于所考虑的二极管在静态和动态条件下的工作，计算结果与测量结果吻合得很好。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Modelling power LEDs in the COB case with thermal phenomena taken into account

The paper refers to modelling power light emitting diodes (LEDs) in the SPICE software with thermal phenomena taken into account. The electro-thermo-optical model of such diodes contained in the common chip on the board (COB) case and the results of experimental verification of the correctness of this model are presented. A good agreement between the results of calculations and measurements was obtained, for operation of the considered diode both in static and dynamic conditions.

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2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition

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