特定结构因素对CVD-HfO/sub /可靠性的影响

Y. Harada, M. Niwa, Sungjoo Lee, D. Kwong
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引用次数: 12

摘要

本文报道了影响CVD-HfO/sub - 2/栅极介质可靠性的两个关键问题。第一类是外源性缺陷,即两种导致大漏电的外源性缺陷。另一个问题是薄膜内部的界面,即由于Si从衬底向外扩散而形成的化学计量界面,以及Si向HfO/sub 2/扩散机制形成的介电常数转变所定义的界面。较低的威布尔斜率/spl beta/主要由Si衬底到k跃迁界面的距离决定。虽然由于k-转变界面的存在,/spl β /变小,但没有k-转变界面的单层硅酸盐可以改善/spl β /。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Specific structural factors influencing on reliability of CVD-HfO/sub 2/
We report on two key issues for CVD-HfO/sub 2/ gate dielectric which influence their reliability. The first is extrinsic defects, i.e. two types of extrinsic defects which lead to large electrical leakage. The other issue is interfaces inside the film, i.e. stoichiometric interfaces due to Si out-diffusion from the substrate, and interfaces defined by dielectric constant transitions formed by a diffusion mechanism of Si into HfO/sub 2/. Lower Weibull slope /spl beta/ is mainly determined by the distance from the Si substrate to the k-transition interface. Although /spl beta/ becomes smaller due to the k-transition interface, it was clarified to be improved by a single layered silicate without k-transition interface.
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