UTBB SOI mosfet自热特性的提取

S. Makovejev, S. Olsen, F. Andrieu, T. Poiroux, O. Faynot, D. Flandre, J. Raskin, V. Kilchytska
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引用次数: 22

摘要

在这项工作中,比较了不同BOX厚度(10和25 nm)的UTBB器件的自热(SH)效应,并评估了不同的自热表征方法。讨论了各种提取技术应用于先进UTBB mosfet时的优缺点。我们表明,尽管热效应在超薄BOX器件中也很重要,但由此产生的漏极电流退化并不严重,并且不受BOX从10纳米加厚到25纳米的影响。与sh相关的主要问题是输出电导退化,这对模拟应用非常重要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
On extraction of self-heating features in UTBB SOI MOSFETs
In this work UTBB devices with different BOX thicknesses of 10 and 25 nm are compared in terms of self-heating (SH) effect Different approaches of SH characterisation are assessed. Strengths and weaknesses of every extraction technique when applied to advanced UTBB MOSFETs are discussed. We show that while thermal effects are important even in devices with ultra-thin BOX, the resulting drain current degradation is not severe and is not considerably affected by BOX thickening from 10 to 25 nm. The main SH-related issue is output conductance degradation, which is of great importance for analogue applications.
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