基于平衡TLM和通孔耦合模型的通孔信号激发的功率/地平面边缘辐射预测与验证

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) Pub Date : 2003-12-08 DOI:10.1109/EPEP.2003.1250027

J. Pak, Junwoo Lee, Hyungsoo Kim, Joungho Kim

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引用次数: 16

摘要

介绍了一种预测通孔信号通孔回断电流路径耦合的功率/地平面共振和边缘辐射的建模和仿真方法，并分析了耦合和辐射机理。通过一系列不同平面条件下的测量，验证了该方法的有效性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Prediction and verification of power/ground plane edge radiation excited by through-hole signal via based on balanced TLM and via coupling model

We introduce a modeling and simulation method to predict power/ground plane resonance and edge radiation coupled from the broken return current path of a through-hole signal via, and analyze the coupling and radiation mechanism. The approach is successfully verified with a series of measurements with various plane conditions.

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来源期刊

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)

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