焊接IGBT模块失效机理及健康评价指标体系研究

2022 3rd International Conference on Advanced Electrical and Energy Systems (AEES) Pub Date : 2022-09-23 DOI:10.1109/AEES56284.2022.10079292

Luzhi Dang, Kai Yang, Qingping Zhang, Yongqiang Kang, Shuaibing Li, Hongwei Li

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引用次数: 0

摘要

随着绝缘栅双极晶体管(IGBT)在电力电子器件中的广泛应用，电力电子器件内部的大功率IGBT模块已经成为制约系统整体可靠性提高的瓶颈，IGBT的可靠性评估也成为当前研究的重要课题。本文在分析IGBT失效机理的基础上，从电气、热、绝缘参数三个方面分析了IGBT健康监测的研究现状。最后，提出了一套较为完整的焊接IGBT健康状态评价指标体系，对电力电子器件IGBT健康状态评价具有重要意义。

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Research on Failure Mechanism and Health Evaluation Index System of Welding IGBT Module

With the wide application of insulated gate bipolar transistor (IGBT) in power electronic devices, high power IGBT module inside power electronic devices has become a bottleneck that restricts the overall reliability improvement of the system, and the reliability evaluation of IGBT has become an important subject of current research. Based on the analysis of IGBT failure mechanism, this paper analyzes the research status of IGBT health monitoring from the perspective of electrical, thermal and insulation parameters. Finally, a more complete set of health status evaluation index system of welded IGBT is proposed, which is of great significance to the health status evaluation of IGBT in power electronic devices.

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2022 3rd International Conference on Advanced Electrical and Energy Systems (AEES)

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