等离子体聚合物薄膜的电子击穿过程

T. Nakano, M. Fukuyama, H. Hayashi, K. Ishii, Y. Ohki
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摘要

有人提出,当电介质击穿是由电子过程引起时,电子的散射会增加介电强度。为了证实这一点,在等离子体聚合物薄膜中引入极性基团,假设极性基团作为散射中心,并测量了介电强度。结果表明,当击穿过程为电子击穿时,由于引入适当数量的电子散射中心(如氮和氟),击穿场增大。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electronic breakdown process of plasma polymer films
It has been suggested that when dielectric breakdown is caused by an electronic process, the scattering of electrons will increase the dielectric strength. To confirm this, polar groups were introduced into plasma-polymer films, assuming that the polar groups would act as scattering centers, and the dielectric strength was measured. It was found that when the breakdown process is electronic, the breakdown field increases due to the introduction of an appropriate number of electron scattering centers such as nitrogen and fluorine.<>
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