新的物理见解模拟应用在PSP散装紧凑模型

S. Martinie, O. Rozeau, T. Poiroux, J. Barbe, F. Gilibert, X. Montagner, Salim El Ghouli, A. Juge, D. J. Geert Smit, A. Scholten
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引用次数: 2

摘要

随着CMOS技术的成熟及其在低压模拟应用中的应用,必须对一些额外的寄生效应进行建模,以再次提高SPICE模型的准确性。事实上,随着电源电压的降低,器件工作在弱反转附近,其中一些效应,如寄生侧壁晶体管,也称为驼峰效应[1],以及界面状态效应[2],会对模型精度产生重大影响。本文描述了与103.6版本相关的PSP模型的最新重大改进,包括寄生MOSFET和界面状态的新紧凑模型。主要的挑战是为大型模拟电路设计提供精确的解决方案,同时降低对CPU时间的影响。模型扩展在硅实验中得到验证,硅实验的通道长度低至40nm,包括低电压和体偏置操作。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
New physical insight for analog application in PSP bulk compact model
With the maturity of CMOS technologies and their use for low voltage analog applications, some additional parasitic effects must be modeled to improve again the accuracy of SPICE models. Indeed, with the decrease of supply voltage, devices operate close to the weak inversion, where some effects such as parasitic sidewall transistor, also called hump effect [1], and the interface states effect [2], can have a significant impact on the model accuracy. This paper describes the latest significant improvements of PSP model related to version 103.6 including new compact models of parasitic MOSFET and interface states. The major challenge is to provide accurate solutions with a low impact on CPU times for large analog circuit designs. The model extensions are validated against Silicon experiments from devices with channel length down to 40nm, and including low voltage and body bias operation.
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