大功率LED模组热湿可靠性研究

K. Pan, Jing Huang, Yu Guo, Renzhang Chen
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引用次数: 0

摘要

LED照明成为第四代绿色照明。然而,在LED的发展和大规模应用方面,LED的可靠性已成为技术瓶颈之一。本文主要针对大功率LED产品存在的可靠性问题,采用实验和仿真相结合的方法对大功率LED模组的热湿可靠性进行了研究。以10W大功率LED模块为实验样本进行了热湿实验,并基于有限元软件ANSYS进行了仿真分析。结果表明,高温是影响大功率LED模组热湿可靠性的主要因素。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Study on the Thermal-Humidity Reliability of High Power LED Module
LED lighting becomes the forth generation green lighting. However, in terms of LED development and large-scale application, the reliability of LED has become one of the technical bottlenecks. This paper carried out the research on the thermal-humidity reliability of high power LED module by the means of experiment and simulation, which mainly aims at the reliability problems existed in high power LED products. Thermal-humidity experiments which takes high power LED module with 10W as the experimental sample and simulation analysis based on FEM (Finite Element Method) software ANSYS are carried out. The results show that, high temperature is the main factor which affects the thermal-humidity reliability of high power LED module.
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