硅片自动光学检测中切口角的自动标定方法

Chao Meng, J. Shi, Fei Hao, Yuan Chao
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引用次数: 3

摘要

为了提高圆片自动光学检测中切口角的精度,提出了一种自动校准方法。首先,建立了检测系统的误差模型,标定了系统角度偏差;接下来,提取多幅图像中基于归一化定位的感兴趣的切边。然后进行考虑系统角度偏差补偿的坐标变换。最后,基于最小二乘法拟合切口边缘线,得到切口角,并通过旋转工作台自动标定切口角。实验结果表明,通过对多幅图像进行坐标变换,增强切角边缘信息,得到的切角相对稳定,切角精度可达0.02度以内。此外,切口角对系统角度偏差更为敏感,结果基本呈线性增加。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An Automatic Calibration Method for Kerf Angle in Wafer Automated Optical Inspection
To improve the accuracy of kerf angle, an automatic calibration method for kerf angle in wafer automated optical inspection is presented. First, the error model of inspection system is established and system angle deviations are calibrated. Next, normalized positioning-based the kerf edges of interest in multiple images are extracted. Then, the coordinate transformation considering the system angle deviation compensation is performed. Finally, the kerf edge line is fitted based on the least squares method to obtain the kerf angle and the kerf angle can be automatically calibrated by rotating the stage. The experimental results show that the kerf angle obtained is relatively stable by coordinate transformation of multiple images to enhance the information of kerf edge and the accuracy of kerf angle can reach within 0.02 degree. Besides, the kerf angle is more sensitive to the system angle deviation and the result is basically a linear increase.
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