载流子温度梯度对热载流子通过半导体结输运的影响

M. El-Saba
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引用次数: 1

摘要

在水动力学模型的基础上,研究了大尺度反偏置电压下p-i-n二极管中热载流子的输运。在击穿区之前,用漂移扩散模型和水动力模型得到的电场分布和总电流密度近似相同。因此,在击穿机制开始之前,电场分布不会受到热载子效应的严重干扰。然而,由于载流子温度梯度的影响,在空间电荷区边缘附近,少数载流子分布和少数载流子电流密度的解存在显著差异。在足够的反向偏压下,发现少数载流子的扩散(在中性区域产生)基本上受载流子温度梯度的影响,而不是漂移扩散理论中已知的载流子浓度梯度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Influence of carrier-temperature gradients on the transport of hot carriers across semiconductor junctions
On the basis of the hydrodynamic model the transport of hot carriers in the p-i-n diode is investigated over a large scale of reverse-bias voltage. the electric field distribution and the total current density which we obtained by both the drift-diffusion model and the hydrodynamic model are approximately identical before the breakdown region. So, the electric field distribution is not severely perturbed by the hot-carrier effects before the onset of the breakdown mechanism. However, the solutions of the minority carrier distribution and the minority carrier current density are significantly different around the edges of space-charge regions due to the carrier-temperature gradients. At sufficient reverse bias, the diffusion of minority carriers (generation in neutral regions) is found to be basically influenced by the carrier-temperature gradient rather than the carrier-concentration gradient as known from the drift-diffusion theory.
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