改进小外形封装微波性能的设计技术

2002 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium. Digest of Papers (Cat. No.02CH37280) Pub Date : 2002-06-02 DOI:10.1109/MWSYM.2002.1011616

D. Jessie, L. Larson

{"title":"改进小外形封装微波性能的设计技术","authors":"D. Jessie, L. Larson","doi":"10.1109/MWSYM.2002.1011616","DOIUrl":null,"url":null,"abstract":"General techniques to improve the microwave performance of plastic leaded packages have been developed. These techniques result in an Improvement of the bandwidth and reduction of losses in the structure. The techniques were applied to an SSOP8 configuration, and the useful frequency range was extended from 6 GHz to well above 10 GHz.","PeriodicalId":299621,"journal":{"name":"2002 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium. Digest of Papers (Cat. No.02CH37280)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-06-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Design techniques for improved microwave performance of small outline packages\",\"authors\":\"D. Jessie, L. Larson\",\"doi\":\"10.1109/MWSYM.2002.1011616\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"General techniques to improve the microwave performance of plastic leaded packages have been developed. These techniques result in an Improvement of the bandwidth and reduction of losses in the structure. The techniques were applied to an SSOP8 configuration, and the useful frequency range was extended from 6 GHz to well above 10 GHz.\",\"PeriodicalId\":299621,\"journal\":{\"name\":\"2002 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium. Digest of Papers (Cat. No.02CH37280)\",\"volume\":\"8 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-06-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2002 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium. Digest of Papers (Cat. No.02CH37280)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MWSYM.2002.1011616\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2002 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium. Digest of Papers (Cat. No.02CH37280)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MWSYM.2002.1011616","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 2

摘要

提高塑料含铅封装微波性能的一般技术已经发展起来。这些技术提高了带宽，减少了结构中的损耗。这些技术应用于sssop8配置，可用频率范围从6 GHz扩展到远高于10 GHz。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Design techniques for improved microwave performance of small outline packages

General techniques to improve the microwave performance of plastic leaded packages have been developed. These techniques result in an Improvement of the bandwidth and reduction of losses in the structure. The techniques were applied to an SSOP8 configuration, and the useful frequency range was extended from 6 GHz to well above 10 GHz.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2002 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium. Digest of Papers (Cat. No.02CH37280)

自引率

0.00%

发文量