企业ssd的可扩展性设计

Arash Tavakkol, M. Arjomand, H. Sarbazi-Azad
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引用次数: 13

摘要

固态硬盘(ssd)最近作为一种高速随机存取替代传统磁盘而出现。迄今为止,SSD设计主要基于多通道总线架构,这在高端企业SSD中面临着严重的可扩展性问题,这些SSD具有数十个闪存芯片和一个千兆字节的主机接口。这迫使社区迅速改变基于总线的内部闪存标准,以响应不断增长的应用需求。在本文中,我们首先深入研究了不同的闪存参数和SSD内部设计如何影响传统架构的实际性能和可扩展性。我们的实验表明,通过增强芯片内并行性或增加闪存单元数量来提高SSD性能受到共享通道上频繁争用的限制。接下来,我们将介绍和评估一种用于ssd闪存通信的基于网络的协议,该协议解决了多通道总线架构的设计限制。该协议利用互联网络的特性,实现高性能SSD。此外,我们将展示和讨论使用这种通信范式不仅有助于获得更好的SSD后端延迟和吞吐量,而且与传统设计相比,还可以降低响应时间的差异。此外,可以添加更多数量的闪存芯片,同时减少对板级信号完整性挑战的担忧,包括通道的最大容性负载、输出驱动器的压摆率和阻抗控制。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design for scalability in enterprise SSDs
Solid State Drives (SSDs) have recently emerged as a high speed random access alternative to classical magnetic disks. To date, SSD designs have been largely based on multichannel bus architecture that confronts serious scalability problems in high-end enterprise SSDs with dozens of flash memory chips and a gigabyte host interface. This forces the community to rapidly change the bus-based inter-flash standards to respond to ever increasing application demands. In this paper, we first give a deep look at how different flash parameters and SSD internal designs affect the actual performance and scalability of the conventional architecture. Our experiments show that SSD performance improvement through either enhancing intra-chip parallelism or increasing the number of flash units is limited by frequent contentions occurred on the shared channels. Our discussion will be followed up by presenting and evaluating a network-based protocol adopted for flash communications in SSDs that addresses design constraints of the multi-channel bus architecture. This protocol leverages the properties of interconnection networks to attain a high performance SSD. Further, we will show and discuss that using this communication paradigm not only helps to obtain better SSD backend latency and throughput, but also to lower the variance of response time compared to the conventional designs. In addition, greater number of flash chips can be added with much less concerns on board-level signal integrity challenges including channels' maximum capacitive load, output drivers' slew rate, and impedance control.
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