高硅化锰薄膜的生长技术及结构性能

T. Kamilov, D. K. Kabilov, I. S. Samiev, H. Husnutdinova, S. Dadamuhamedov, V. Klechkovskaya
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引用次数: 1

摘要

高硅化锰- MnSi/sub /spl sim/1.7/具有半导体性质,是一种很有前途的高温热电材料。在这项工作中,我们报道了在硅衬底上形成的连续的高硅化锰薄膜的生长。详细介绍了高硅化锰薄膜的生长工艺。用扫描电子x射线微量分析仪测定了硅化物膜的元素相组成。给出了样品的Si和Mn掺杂深度分布图。通过实验研究,我们找到了生长多晶高硅化锰薄膜的最佳操作条件。结果表明,在衬底温度T/sub /= 1040 ~ 1060/spl℃下生长的硅化物层主要由高锰自杀MnSi/sub 1.71 ~ 1.75/晶粒组成,厚度为5 ~ 30 /spl mu/m,沿衬底法向取向。用电子衍射研究了生长的硅化物薄膜的结构,并用扫描电子显微镜研究了这些薄膜的形貌。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Growth technique and structural properties of the higher manganese silicide films
Higher manganese silicide - MnSi/sub /spl sim/1.7/ was found as semiconducting and can be a promising thermoelectric material for high temperature applications. In this work, we report the growth of continuous higher manganese silicide film formed on silicon substrate. The growth technique of the higher manganese silicide films was described in detail. The element-phase composition of the silicide films was determined by scanning electron X-ray microanalyzer. Si and Mn doping depth profiles of the samples were presented. As a result of the experimental investigation we found optimal operating conditions to grow polycrystalline higher manganese silicide films. It was established that the grown silicide layer at the substrate temperature T/sub sub/= 1040-1060/spl deg/C consist predominantly of higher manganese suicide MnSi/sub 1.71-1.75/ grains with thickness ranging from 5 to 30 /spl mu/m and oriented along the substrate normal. The structure of grown silicide films was studied by electron diffraction, and the morphology of these films studied using scanning electron microscopy.
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