多层陶瓷电容器噪声解决方案

C. Covaci, Florin Burza, A. Gontean
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引用次数: 1

摘要

多层陶瓷电容器(MLCC)存在于每一个电子设备中。不幸的是,由于它们是由介电材料制成的,它们在电场的存在下会振动。这种振动通过焊点传递到PCB,产生被称为“唱歌”电容现象的噪声。有多种解决方案可以减弱这种现象。本文研究了焊膏减少、烘箱固化、涂漆、MLCC取向和布局优化对MLCC噪声的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Solutions for Acoustic Noise caused by Multilayer Ceramic Capacitors
Multilayer ceramic capacitors (MLCC) are present in every electronic device. Unfortunately, due to the dielectric material they are made of, they vibrate in the presence of an electric field. This vibration is transferred to the PCB via the solder joint creating the acoustic noise known as “singing” capacitor phenomenon. There are multiple solutions to attenuate this phenomenon. In this paper, we investigate the effect of solder paste reduction, oven curing, varnishing, MLCC orientation, and layout optimization on the acoustic noise caused by MLCCs.
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