60 GHz频段应用的封装天线建模

CAS 2010 Proceedings (International Semiconductor Conference) Pub Date : 2010-12-03 DOI:10.1109/SMICND.2010.5650742

A. Muller, S. Sinha, D. Neculoiu, D. Dascalu

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引用次数: 0

摘要

本文介绍了一种60 GHz封装天线的仿真技术及其设计结果。利用Zeland IE3D进行了仿真，并用Mathematica进行了分析，并进行了比较，以获得60ghz天线三维模拟器的正确设置。利用Zeland IE3D矩量模拟器分析了不同天线拓扑的辐射效率;提出了一些具体的改进技术。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Modeling of antenna on package for the 60 GHz frequency band applications

The paper describes the simulation techniques used and results for the design of a 60 GHz antenna on package. Simulations performed with Zeland IE3D and analysis by Mathematica are presented and compared in order to get the 3D simulator in a correct setup for the 60 GHz antenna. The radiation efficiency is analyzed for different antenna topologies by the Zeland IE3D method of moments simulator; some specific techniques for improving it are presented.

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CAS 2010 Proceedings (International Semiconductor Conference)

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