采用CMOS 350nm和FDSOI 28nm的射频能量收集整流天线设计

E. Rochefeuille, F. Alicalapa, A. Douyère, T. Vuong
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引用次数: 0

摘要

减少能耗和微电子电路尺寸的需求日益增加。为了支持这一要求,本文提出了两种集成技术的比较研究:FDSOI 28nm和CMOS 350nm。这项工作的目的是比较这两种技术在整流器和Dickson电荷泵整流应用设计中的性能。结果表明,在输入电压和功率低至0.5 V和0 dBm的情况下,FDSOI技术的简单整流器输出电压增益提高了22%,Dickson电荷泵输出电压增益提高了16%。这些结果证明FDSOI 28nm是能量收集和低功耗应用的更好技术选择。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Rectenna design for RF energy harvesting using CMOS 350nm and FDSOI 28nm
The need for the reduction of energy consumption and size of microelectronic circuits is increasingly in demand. To support this request, this paper presents a comparison study on two integrated technologies: FDSOI 28nm and CMOS 350nm. The aim of this work was to compare the performance of these two technologies for the design of a rectifier and a Dickson charge pump for rectenna application. The results showed an improved 22%-output voltage gain for a given simple rectifier and a 16%-output voltage gain for a Dickson charge pump in FDSOI technology compared to CMOS, for an input voltage and power as low as 0.5 V and 0 dBm. Those results allowed to prove that FDSOI 28nm is a better technology choice for Energy Harvesting and Low-Power applications.
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