InP/GaAsSb双异质结双极晶体管的仿真研究

P. Balaraman, K. Roenker
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引用次数: 0

摘要

利用商业数值器件模拟器,采用二维漂移扩散方法进行器件建模,研究了InP/GaAsSb异质结双极晶体管(HBTs)的工作和性能。与InP匹配的GaAsSb晶格具有与InGaAs (0.75 eV)相似的能带隙(0.72 eV),因此sb基HBTs被提议作为InGaAs基HBTs的替代品。特别是,导带排列在基极集电极处更有利,这使得基于gaassb的hbt对需要更高击穿电压的双异质结双极晶体管(dhbt)特别有吸引力。在这项工作中,器件建模的结果将首先与最近的实验报告进行比较,以验证建模方法。随后,将检查设备的设计和操作,以调查控制设备性能的因素,以促进设备设计的改进。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Simulation study of InP/GaAsSb double heterojunction bipolar transistors
Device modeling using a two dimensional, drift-diffusion approach utilizing a commercial numerical device simulator has been used to investigate the operation and performance of InP/GaAsSb heterojunction bipolar transistors (HBTs). GaAsSb lattice matched to InP has an energy bandgap (0.72 eV) that is similar to that of InGaAs (0.75 eV) so that Sb-based HBTs have been proposed as a replacement for InGaAs-based HBTs. In particular, the conduction band lineup is more favorable at the base-collector, which makes the GaAsSb-based HBTs especially attractive for double heterojunction bipolar transistors (DHBTs) where higher breakdown voltages are desired. In this work, the results of device modeling will be compared initially with recent experimental reports to validate the modeling approach. Subsequently, the design and operation of the devices will be examined to investigate the factors controlling device performance in order to facilitate improvements in device design.
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