通过测量方法和仿真模型预测集成电路的抗扰度

2007 18th International Zurich Symposium on Electromagnetic Compatibility Pub Date : 2007-11-27 DOI:10.1109/EMCZUR.2007.4388200

A. Alaeldine, Jerome Cordi, R. Perdriau, M. Ramdani, J. Levant

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引用次数: 9

摘要

本文介绍了典型集成电路电磁抗扰度测试的完整仿真模型。对直接功率注入(DPI)、近场(NF)和快速传输线脉冲(VF-TLP)实验进行了精确建模，并对每种设置的仿真和测量结果进行了比较，证明了该方法的有效性，并促进了集成电路抗扰度预测方法的发展。

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Predicting the immunity of integrated circuits through measurement methods and simulation models

This paper introduces complete simulation models of typical electromagnetic immunity tests for integrated circuits (ICs). Direct Power Injection (DPI), Near-field (NF) and Very- Fast Transmission Line Pulsing (VF-TLP) experiments are modeled accurately, and comparisons between simulations and measurements for each set-up demonstrate the validity of this approach and lead to the development of an immunity prediction method for ICs.

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2007 18th International Zurich Symposium on Electromagnetic Compatibility

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