IGBT结温测量和估计方法的比较综述

M. Sathik, J. Pou, S. Prasanth, V. Muthu, R. Simanjorang, A. Gupta
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引用次数: 45

摘要

近年来功率半导体器件市场的增长主要是由于可再生能源、电动汽车、航空航天、海洋和应用领域对有效转换和分配能源的需求不断增长。对于安全,关键应用,温度管理和控制是最重要的功能。因此,估计或测量功率半导体器件的结温对进行热管理和转换器控制是有用的。已经发表了几种测量绝缘栅双极晶体管(IGBT)结温的方法。本文综述了功率半导体器件结温测量的历史发展和最新进展。最后,对今后的工作提出了建议。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Comparison of IGBT junction temperature measurement and estimation methods-a review
Recent growth of power semiconductor device market has been driven largely by the growing demand for an efficient way to convert and distribute energy in the field of renewable energy, electrical vehicles, aerospace, marine and applications. For safety, critical applications, temperature management and control are the most important functions. Therefore, estimating or measuring the junction temperature of the power semiconductor device is useful to perform thermal management and converter control. Several methods have been published to measure the junction temperature of the insulated gate bipolar transistor (IGBT). This paper attempts to summarize the past developments and recent advances in measuring junction temperature of power semiconductor device is presented. Finally, the promising methods are recommended for future work.
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