新型体系FinFET单元阵列晶体管DRAM,负字线操作,适用于60nm及以下技术

C.H. Lee, J. Yoon, C. Lee, H.M. Yang, K.N. Kim, T.Y. Kim, H. Kang, Y. Ahn, Donggun Park, Kinam Kim
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引用次数: 22

摘要

本文成功集成了一种基于体块硅衬底的新型体系FinFET单元阵列晶体管的高量产512M FinFET DRAM,并首次将其性能与RCAT(凹槽通道阵列晶体管)和平面单元阵列晶体管DRAM进行了比较。我们还提出了低通道掺杂体绑定FinFET的NWL(负字线)方案,用于60nm以下技术节点的高度可制造的FinFET DRAM。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Novel body tied FinFET cell array transistor DRAM with negative word line operation for sub 60nm technology and beyond
In this paper, a highly manufacturable 512M FinFET DRAM with novel body tied FinFET cell array transistor on bulk Si substrate has been successfully integrated and the characteristics were compared with RCAT (Recess Channel Array Transistor) and planar cell array transistor DRAM for the first time. We also propose the NWL (Negative Word Line) scheme with low channel doping body tied FinFET for a highly manufacturable FinFET DRAM for sub 60nm technology node.
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