传输线脉冲测量的验证结构

Proceedings of the 2002 International Conference on Microelectronic Test Structures, 2002. ICMTS 2002. Pub Date : 2002-04-08 DOI:10.1109/ICMTS.2002.1193191

R. Ashton

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引用次数: 0

摘要

设计并测试了用于传输线脉冲(TLP)系统性能验证的测试结构。它们由铜或硅化物包覆多晶硅的简单电阻器组成。由于过热和任何合理几何形状的熔化，铜结构被证明是不合适的。硅化物包覆的多晶硅被证明更为成功。一个简单的电阻加热模型解释了观察到的结构在大电流应力下的非线性。

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Verification structures for transmission line pulse measurements

Test structures intended for performance verification of transmission line pulse (TLP) systems have been designed and tested. They consist of simple resistors in either copper or silicide clad polysilicon. The copper structures proved unsuitable due to excess heating and melting of any reasonable geometry. The silicide clad polysilicon proved more successful. A simple model of resistive heating accounts for observed non-linearity in the structures under high current stress.

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Proceedings of the 2002 International Conference on Microelectronic Test Structures, 2002. ICMTS 2002.

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