硅通孔在毫米波硅基天线中的应用

2017 2nd IEEE International Conference on Integrated Circuits and Microsystems (ICICM) Pub Date : 2017-11-01 DOI:10.1109/ICAM.2017.8242194

Zhou Dali, Yang Jiapeng, Zhou Jun, Shen Ya

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引用次数: 0

摘要

本文通过布置硅通孔(tsv)形成矩形谐振腔来提高硅基天线的性能。根据矩形谐振腔的基本理论，分析了硅通孔谐振腔的模型。考虑毫米波天线的尺寸，计算了TE101模腔的三维尺寸。将谐振腔应用于共面波导耦合缝隙天线，可以产生一个新的频率，从而实现双频带或更宽的带宽。辐射增益可提高1.9dB。因此，通过硅通孔技术提高硅基天线的性能是非常有效的。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Application of through silicon vias on millimeter-wave silicon based antenna

Through silicon vias (TSVs) are arranged to form a rectangular resonant cavity to improve performance of silicon based antenna in this paper. On the basis of fundamental theory of rectangular resonant cavity, the model of cavity made of through silicon vias is analyzed. Considering the size of millimeter-wave antenna, the three dimensions of cavity for mode TE101 is calculated. Applying the resonant cavity on coplanar waveguide (CPW) coupled slot antenna, a new frequency is generated which can lead to dual bands or a wider bandwidth. And the radiation gain can be improved by 1.9dB. So the application of through silicon via on improving performances of silicon based antenna is effective enough.

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2017 2nd IEEE International Conference on Integrated Circuits and Microsystems (ICICM)

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