采用转移多芯片键合的平行板间光互连模块的制造

A. Ohki, M. Usui, N. Sato, N. Matsuura, K. Katsura, Y. Ando
{"title":"采用转移多芯片键合的平行板间光互连模块的制造","authors":"A. Ohki, M. Usui, N. Sato, N. Matsuura, K. Katsura, Y. Ando","doi":"10.1109/IEMTIM.1998.704537","DOIUrl":null,"url":null,"abstract":"ParaBIT (parallel inter-board optical interconnection technology) is a promising candidate for large-capacity board-to-board interconnection. In ParaBIT module assembly, a new multichip diebonding technique is needed, because precise optical device chip mounting is required for efficient optical coupling at the E/O (electric/optic conversion) and O/E (optic/electric conversion) interfaces. In this paper, we have proposed a new technique, called TMB (transferred multichip bonding), for the precise mounting of multiple optical device chips. We have also described the detailed procedures of TMB and demonstrated its use in ParaBIT module assembly.","PeriodicalId":260028,"journal":{"name":"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-04-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Fabrication of a parallel inter-board optical interconnection module using transferred multichip bonding\",\"authors\":\"A. Ohki, M. Usui, N. Sato, N. Matsuura, K. Katsura, Y. Ando\",\"doi\":\"10.1109/IEMTIM.1998.704537\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"ParaBIT (parallel inter-board optical interconnection technology) is a promising candidate for large-capacity board-to-board interconnection. In ParaBIT module assembly, a new multichip diebonding technique is needed, because precise optical device chip mounting is required for efficient optical coupling at the E/O (electric/optic conversion) and O/E (optic/electric conversion) interfaces. In this paper, we have proposed a new technique, called TMB (transferred multichip bonding), for the precise mounting of multiple optical device chips. We have also described the detailed procedures of TMB and demonstrated its use in ParaBIT module assembly.\",\"PeriodicalId\":260028,\"journal\":{\"name\":\"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)\",\"volume\":\"25 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1998-04-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMTIM.1998.704537\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMTIM.1998.704537","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5

摘要

平行板间光互连技术(ParaBIT)是大容量板对板互连的一个很有前途的候选技术。在ParaBIT模块组装中,由于精确的光学器件芯片安装需要在E/O(电/光转换)和O/E(光/电转换)接口上实现有效的光耦合,因此需要一种新的多芯片diebonding技术。在本文中,我们提出了一种新的技术,称为TMB(转移多芯片键合),用于精确安装多个光学器件芯片。本文还详细介绍了TMB的实现过程,并演示了TMB在ParaBIT模块组装中的应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fabrication of a parallel inter-board optical interconnection module using transferred multichip bonding
ParaBIT (parallel inter-board optical interconnection technology) is a promising candidate for large-capacity board-to-board interconnection. In ParaBIT module assembly, a new multichip diebonding technique is needed, because precise optical device chip mounting is required for efficient optical coupling at the E/O (electric/optic conversion) and O/E (optic/electric conversion) interfaces. In this paper, we have proposed a new technique, called TMB (transferred multichip bonding), for the precise mounting of multiple optical device chips. We have also described the detailed procedures of TMB and demonstrated its use in ParaBIT module assembly.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信