印制电路板拼接对辐射发射的影响

1999 IEEE International Symposium on Electromagnetic Compatability. Symposium Record (Cat. No.99CH36261) Pub Date : 1999-08-02 DOI:10.1109/ISEMC.1999.810120

G. Haussmann, M. Matthews, F. Gisin

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引用次数: 5

摘要

使用紧密间隔的过孔或“拼接”，用于减少印刷电路板(PCB)边缘的辐射发射。然而，这种拼接通过将电磁噪声限制在PCB内部而不是允许其辐射，从而导致与内部走线和过孔耦合的不良影响。连接到外部走线和组件的内部走线提供了除拼接要抑制的边缘辐射之外的第二辐射路径。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Impact on radiated emissions of printed circuit board stitching

The use of closely-spaced vias, or "stitching", is used to reduce radiated emissions from the edge of a printed circuit board (PCB). However, this stitching, by confining the electromagnetic noise to the PCB internals instead of allowing it to radiate, causes undesirable effects by coupling to internal traces and vias. Internal traces connected to outside traces and components provide a second path for radiation, in addition to the edge radiation that stitching is intended to suppress.

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1999 IEEE International Symposium on Electromagnetic Compatability. Symposium Record (Cat. No.99CH36261)

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