{"title":"非相干超宽带(UWB)系统级封装(SiP)的三维误码率开度信号质量测试","authors":"C. Yoon, Jiseong Kim, Joungho Kim","doi":"10.1109/EDAPS.2009.5404017","DOIUrl":null,"url":null,"abstract":"This paper introduces a proper quality test of RZ modulated digital signal from non-coherent recovery process in Ultra Wide-Band (UWB) transceiver which is designed by System-in-Package (SiP) technology for wireless mobile application. 3-Dimensional (3D) BER with a marginal window which is multiple sampling points set in eye-diagram is proposed. An area of 3D BER opening at specific BER level provides a noise immunity and susceptibility of whole system in advance.","PeriodicalId":370741,"journal":{"name":"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Signal quality test with 3-Dimensional BER opening for non-coherent Ultra Wide-Band (UWB) System-in-Package (SiP)\",\"authors\":\"C. Yoon, Jiseong Kim, Joungho Kim\",\"doi\":\"10.1109/EDAPS.2009.5404017\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper introduces a proper quality test of RZ modulated digital signal from non-coherent recovery process in Ultra Wide-Band (UWB) transceiver which is designed by System-in-Package (SiP) technology for wireless mobile application. 3-Dimensional (3D) BER with a marginal window which is multiple sampling points set in eye-diagram is proposed. An area of 3D BER opening at specific BER level provides a noise immunity and susceptibility of whole system in advance.\",\"PeriodicalId\":370741,\"journal\":{\"name\":\"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)\",\"volume\":\"34 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EDAPS.2009.5404017\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDAPS.2009.5404017","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Signal quality test with 3-Dimensional BER opening for non-coherent Ultra Wide-Band (UWB) System-in-Package (SiP)
This paper introduces a proper quality test of RZ modulated digital signal from non-coherent recovery process in Ultra Wide-Band (UWB) transceiver which is designed by System-in-Package (SiP) technology for wireless mobile application. 3-Dimensional (3D) BER with a marginal window which is multiple sampling points set in eye-diagram is proposed. An area of 3D BER opening at specific BER level provides a noise immunity and susceptibility of whole system in advance.
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