{"title":"SoC设计中的验证和测试挑战","authors":"C.A.M. Duenas","doi":"10.1145/1016568.1016573","DOIUrl":null,"url":null,"abstract":"SoC (system-on-chip) designs have introduced several new challenges for the functional verification and test disciplines. Besides the ever-growing functional complexity, we need to manage from several clock domains and low-power modes to all sorts of IP blocks like processors, complex peripherals, analog functions and different kinds of embedded memories. The reuse of 3/sup rd/ party IP may help accelerating the design of new products, but it usually does not help the functional verification and it may even add to its complexity. The same die may be used in several packages with a different number of pins and bond-out options. This presentation discusses these and other verification and test challenges. It also describes what tools, techniques and methodologies the industry is currently using to cope with them, and finalizes outlining some future directions.","PeriodicalId":275811,"journal":{"name":"Proceedings. SBCCI 2004. 17th Symposium on Integrated Circuits and Systems Design (IEEE Cat. No.04TH8784)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-09-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Verification and test challenges in SoC designs\",\"authors\":\"C.A.M. Duenas\",\"doi\":\"10.1145/1016568.1016573\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"SoC (system-on-chip) designs have introduced several new challenges for the functional verification and test disciplines. Besides the ever-growing functional complexity, we need to manage from several clock domains and low-power modes to all sorts of IP blocks like processors, complex peripherals, analog functions and different kinds of embedded memories. The reuse of 3/sup rd/ party IP may help accelerating the design of new products, but it usually does not help the functional verification and it may even add to its complexity. The same die may be used in several packages with a different number of pins and bond-out options. This presentation discusses these and other verification and test challenges. It also describes what tools, techniques and methodologies the industry is currently using to cope with them, and finalizes outlining some future directions.\",\"PeriodicalId\":275811,\"journal\":{\"name\":\"Proceedings. SBCCI 2004. 17th Symposium on Integrated Circuits and Systems Design (IEEE Cat. No.04TH8784)\",\"volume\":\"4 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-09-04\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings. SBCCI 2004. 17th Symposium on Integrated Circuits and Systems Design (IEEE Cat. No.04TH8784)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/1016568.1016573\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. SBCCI 2004. 17th Symposium on Integrated Circuits and Systems Design (IEEE Cat. No.04TH8784)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/1016568.1016573","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
摘要
SoC(片上系统)设计为功能验证和测试学科带来了几个新的挑战。除了不断增长的功能复杂性,我们需要管理从多个时钟域和低功耗模式到各种IP块,如处理器,复杂外设,模拟功能和不同类型的嵌入式存储器。3/sup / party IP的重用可能有助于加速新产品的设计,但它通常无助于功能验证,甚至可能增加其复杂性。相同的模具可用于具有不同数量引脚和粘接选项的几个封装中。本演讲将讨论这些以及其他验证和测试挑战。它还描述了行业目前使用的工具、技术和方法,并最终概述了一些未来的方向。
SoC (system-on-chip) designs have introduced several new challenges for the functional verification and test disciplines. Besides the ever-growing functional complexity, we need to manage from several clock domains and low-power modes to all sorts of IP blocks like processors, complex peripherals, analog functions and different kinds of embedded memories. The reuse of 3/sup rd/ party IP may help accelerating the design of new products, but it usually does not help the functional verification and it may even add to its complexity. The same die may be used in several packages with a different number of pins and bond-out options. This presentation discusses these and other verification and test challenges. It also describes what tools, techniques and methodologies the industry is currently using to cope with them, and finalizes outlining some future directions.