温度变化下MEMS结构读出集成电路模拟路径性能分析

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) Pub Date : 2022-05-31 DOI:10.1109/iTherm54085.2022.9899610

M. Jankowski, J. Nazdrowicz, A. Napieralski

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引用次数: 1

摘要

本文给出了在一定工作温度范围内电容式模拟读出电路特性的时间分析。对基于原理图和基于布局后提取的行为进行了比较，分析包括仿真结果和测量结果，并对其进行了比较。分析了电路读出值的温度关系，并说明了环境温度对噪声水平的影响。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Performance Analysis of the Analog Path of Read-Out Integrated Circuit for MEMS structures under Temperature Variation

The paper presents a time-analysis of capacitive analog readout circuit properties for a range of operating temperatures. Comparison of schematic-based and post-layout extraction-based behavior is conducted, and the analysis includes and compares simulation and measurement results. The presented analysis identifies the temperature-relation of the circuit readout values as well as shows the influence of environment temperature on noise levels.

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来源期刊

2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)

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