{"title":"用回流工艺减少焊接热处理后PCB变形的方法","authors":"V. Tsenev, V. Videkov","doi":"10.1109/ET50336.2020.9238213","DOIUrl":null,"url":null,"abstract":"The report presents approach to reduce PCB distortion after heat treatment for soldering using a reflow process. The influence of the temperature profile at different heating of the lower side of the board has been studied and an optimal one has been established, in which the distortion of the boards is minimal and there is no danger of creating defects on the lower side. Conclusions are made when this approach can be used and how a secure temperature profile can be achieved for minimal board distortion after soldering with a reflow process.","PeriodicalId":178356,"journal":{"name":"2020 XXIX International Scientific Conference Electronics (ET)","volume":"abs/1512.03088 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-09-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Approach to reduce PCB distortion after heat treatment for soldering with reflow process\",\"authors\":\"V. Tsenev, V. Videkov\",\"doi\":\"10.1109/ET50336.2020.9238213\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The report presents approach to reduce PCB distortion after heat treatment for soldering using a reflow process. The influence of the temperature profile at different heating of the lower side of the board has been studied and an optimal one has been established, in which the distortion of the boards is minimal and there is no danger of creating defects on the lower side. Conclusions are made when this approach can be used and how a secure temperature profile can be achieved for minimal board distortion after soldering with a reflow process.\",\"PeriodicalId\":178356,\"journal\":{\"name\":\"2020 XXIX International Scientific Conference Electronics (ET)\",\"volume\":\"abs/1512.03088 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-09-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 XXIX International Scientific Conference Electronics (ET)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ET50336.2020.9238213\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 XXIX International Scientific Conference Electronics (ET)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ET50336.2020.9238213","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Approach to reduce PCB distortion after heat treatment for soldering with reflow process
The report presents approach to reduce PCB distortion after heat treatment for soldering using a reflow process. The influence of the temperature profile at different heating of the lower side of the board has been studied and an optimal one has been established, in which the distortion of the boards is minimal and there is no danger of creating defects on the lower side. Conclusions are made when this approach can be used and how a secure temperature profile can be achieved for minimal board distortion after soldering with a reflow process.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
