大功率脉冲离子束对钨表面形貌的影响

A. Ligachev, M. Zhidkov, Y. Kolobov, G. Potemkin, M. V. Lukahova, G. Remnev, S. Pavlov, G. E. Tarbokov
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引用次数: 0

摘要

采用高功率脉冲离子束在TEMP加速器(Cn+离子,加速电压200±10 kV,单脉冲能量密度2.6 ~ 3.0 J/cm2)下加工钨表面。用扫描电镜研究了钨试样表面起伏和结构的变化。经强脉冲离子束(MIIP)处理后,在钨表面形成凹坑形式的缺陷。陨石坑的数量随着撞击脉冲数量的增加而减少。经3次脉冲照射后,沿晶界在表层形成微坑。经过10次脉冲后,辐照表面几乎没有裂纹。脉冲数的增加导致钨近表层形成更等轴的超细晶结构。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The effect of a high-power pulsed ion beam on the surface topography of the tungsten
The tungsten surface was processed by high power pulsed ion beam at the TEMP accelerator (Cn+ ions, accelerating voltage 200 ± 10 kV, energy density of a single pulse 2.6 – 3.0 J/cm2). Changes in the relief and structure of the surface of tungsten samples were studied by scanning electron microscopy. After treatment with a powerful pulsed ion beam (MIIP), defects in the form of craters form on the surface of tungsten. The number of craters decreases with an increase in the number of impact pulses. After exposure to 3 pulses, microcraters are forms in the surface layer along the grain boundaries. After 10 pulses, there are practically no cracks on the irradiated surface. An increase in the number of pulses leads to the formation of a more equiaxed ultrafine-grained structure in the near-surface layer of tungsten.
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