硅衬底上嵌入SiO2的InAs量子点记忆效应的电学研究

M. Hocevar, N. Baboux, A. Poncet, P. Regreny, M. Gendry, A. Souifi
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引用次数: 2

摘要

采用分子束外延法(MBE)在SiO2上直接生长了基于InAs纳米晶的记忆结构。纳米晶体的典型直径为5nm,密度约为2倍1011 cm-2。高分辨率透射电镜测量显示高晶体质量和低尺寸色散。利用这些7纳米量子点,对一个具有3.5纳米厚SiO2隧道氧化物和10纳米厚对照氧化物的测试结构进行了数据保留测量。我们观察到,最初注入的电子在三个月后仍有80%被储存起来。这些结果在InAs纳米晶体中的电子保留时间比硅或锗量子点的类似结构要好得多。最后,我们证明了3.5 nm厚的隧道氧化物、10 nm直径的纳米- inas和7 nm厚的控制氧化物的优化结构在W/E时间、W/E工作电压和数据保留方面可以满足工业对非易失性存储器的要求。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electrical study of memory effects in InAs quantum dots embedded in SiO2 on silicon substrates
Memory structures based on InAs nanocrystals directly grown by molecular beam epitaxy (MBE) on SiO2 have been studied. The nanocrystals have a typical diameter of 5 nm and the density is about 2 times 1011 cm-2. High resolution TEM measurements have shown high crystalline quality and low size dispersion. Using these 7 nm-quantum dots, a test structure with a 3.5 nm-thick SiO2 tunnel oxide and a 10 nm-thick control oxide has been processed for data retention measurements. We have observed that 80 % of the initial injected electrons are still stored after three months. These results for the retention time of electrons in InAs nanocrystals are much better than comparable structures with silicon or germanium quantum dots. Finally, we demonstrate that an optimized structure with 3.5 nm-thick tunnel oxides, 10 nm-in diameter nc-InAs and 7 nm-thick control oxides could fill the industrial requirements for nonvolatile memories in terms of W/E time, W/E operating voltage and data retention.
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