高k介电介质和金属栅极堆叠finfet寄生电容的测量与分析

A. Dixit, A. Bandhyopadhyay, N. Collaert, K. Meyer, M. Jurczak
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引用次数: 2

摘要

FinFET是32nm以下CMOS技术节点中最有前途的器件架构之一。这些非平面器件得益于接近块状硅的处理和准栅极全方位操作所带来的短通道控制的改进。近五年来,各研究小组对其设备运行进行了深入的研究和优化。在本文中,我们通过实验比较其寄生电容与平面FDSOI mosfet的寄生电容来帮助评估finfet的电路电位。结果表明,与平面FDSOI mosfet相比,n沟道和p沟道finfet的寄生电容分别降低了50%和28%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Measurement and Analysis of Parasitic Capacitance in FinFETs with High-k Dielectrics and Metal-Gate Stack
FinFET is one of the promising device architectures for sub-32nm CMOS technology nodes. These non-planar devices benefit from near bulk-Si processing and improved control of short channels due to quasi gate-all-around operation. Their device operation is well studied and optimized in last half decade by various research groups. In this paper, we help evaluate the circuit potential of FinFETs by experimentally comparing their parasitic capacitance to that of the planar FDSOI MOSFETs. It is shown that n- and p-channel FinFETs achieve as high as 50% and 28% parasitic capacitance reduction compared to the planar FDSOI MOSFETs respectively.
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