温度和器件尺寸依赖于PMOSFET的阈值电压、低场迁移率和串联寄生电阻

N. Sakuna, R. Muanghlua, S. Niemcharoen, A. Ruangphanit, A. Poyai
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引用次数: 1

摘要

本文介绍了在27℃至125℃工作温度范围内,PMOS的阈值电压、低场迁移率和串联寄生电阻对温度和器件尺寸的依赖性。在不同的通道长度和通道宽度下,利用线性区域内的IDS和VGS关系。参数提取过程是基于对线性区MOSFET跨导特性的测量。结果表明,阈值电压温度系数约为1.7mV/K左右。低场迁移率退化参数降低了0.68倍。单位通道宽度源漏串联电阻(RDSW)的温度系数约为16.7欧姆/K。这些数据是必要的,不仅应该与NMOS的结果进行比较,而且应该用于电路设计人员更好地了解在升高的工作温度下的情况。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Temperature and devices dimension dependence on threshold voltage, the low field mobilty and the series parasitic resistance of PMOSFET
This paper presents the temperature and devices dimension dependence on the threshold voltage, low field mobility and series parasitic resistance of PMOS over operating temperature range of 27 °C to 125 °C. The relation of IDS and VGS in linear region was used with a different of channel length and channel width. The parameters extraction procedure is based on the measurement of the transconductance characteristics of MOSFET in linear region. The results show that, the temperature coefficient for threshold voltage is around 1.7mV/K approximately. The low field mobility degradation parameter is decreased by the factor of 0.68. The temperature coefficient of source-drain series resistance per unit channel width (RDSW) is approximately 16.7 ohm-um/K. These data are necessary not only should be compared with the results of NMOS but also should be used for the circuit designer to understanding well in the elevated operating temperatures.
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