{"title":"毫米带腔的先进微加工技术","authors":"M. Verdiel, J. Protz","doi":"10.1109/IVELEC.2007.4283251","DOIUrl":null,"url":null,"abstract":"microfabrication recipe involving Deep Reactive Ion Etching, Chemical Mechanical Polishing, and Silicon Direct Bonding is proposed as a way to fabricate high precision cavities for millimetre band devices. The effect of fabrication variances on device performance is predicted.","PeriodicalId":254940,"journal":{"name":"2007 IEEE International Vacuum Electronics Conference","volume":"40 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Advanced Microfabrication Techniques for Millimetre Band Cavities\",\"authors\":\"M. Verdiel, J. Protz\",\"doi\":\"10.1109/IVELEC.2007.4283251\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"microfabrication recipe involving Deep Reactive Ion Etching, Chemical Mechanical Polishing, and Silicon Direct Bonding is proposed as a way to fabricate high precision cavities for millimetre band devices. The effect of fabrication variances on device performance is predicted.\",\"PeriodicalId\":254940,\"journal\":{\"name\":\"2007 IEEE International Vacuum Electronics Conference\",\"volume\":\"40 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-05-15\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 IEEE International Vacuum Electronics Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IVELEC.2007.4283251\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE International Vacuum Electronics Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IVELEC.2007.4283251","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Advanced Microfabrication Techniques for Millimetre Band Cavities
microfabrication recipe involving Deep Reactive Ion Etching, Chemical Mechanical Polishing, and Silicon Direct Bonding is proposed as a way to fabricate high precision cavities for millimetre band devices. The effect of fabrication variances on device performance is predicted.
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