{"title":"应用多用途扫描探针显微镜研究电压作用下的功率半导体器件","authors":"N. Satoh, A. Doi, H. Yamamoto","doi":"10.1109/WiPDAAsia49671.2020.9360252","DOIUrl":null,"url":null,"abstract":"Power semiconductor devices are progressing towards high-withstand voltage using wide bandgap semiconductor materials as well as having the ability to flow a significant amount of current by multi-parallel integration using the microfabrication technique. A power semiconductor device under a bias voltage applied condition by a scanning probe microscope (SPM) was successfully observed, combined with atomic force microscopy (AFM), Kelvin probe force microscopy (KFM), and scanning capacitance force microscopy (SCFM). Using the SPM analysis, both, a high spatial-resolution and high sensitivity was achieved.","PeriodicalId":432666,"journal":{"name":"2020 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-09-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Investigation of power semiconductor devices under applying voltage by multi-purpose scanning probe microscope\",\"authors\":\"N. Satoh, A. Doi, H. Yamamoto\",\"doi\":\"10.1109/WiPDAAsia49671.2020.9360252\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Power semiconductor devices are progressing towards high-withstand voltage using wide bandgap semiconductor materials as well as having the ability to flow a significant amount of current by multi-parallel integration using the microfabrication technique. A power semiconductor device under a bias voltage applied condition by a scanning probe microscope (SPM) was successfully observed, combined with atomic force microscopy (AFM), Kelvin probe force microscopy (KFM), and scanning capacitance force microscopy (SCFM). Using the SPM analysis, both, a high spatial-resolution and high sensitivity was achieved.\",\"PeriodicalId\":432666,\"journal\":{\"name\":\"2020 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)\",\"volume\":\"34 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-09-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/WiPDAAsia49671.2020.9360252\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/WiPDAAsia49671.2020.9360252","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Investigation of power semiconductor devices under applying voltage by multi-purpose scanning probe microscope
Power semiconductor devices are progressing towards high-withstand voltage using wide bandgap semiconductor materials as well as having the ability to flow a significant amount of current by multi-parallel integration using the microfabrication technique. A power semiconductor device under a bias voltage applied condition by a scanning probe microscope (SPM) was successfully observed, combined with atomic force microscopy (AFM), Kelvin probe force microscopy (KFM), and scanning capacitance force microscopy (SCFM). Using the SPM analysis, both, a high spatial-resolution and high sensitivity was achieved.