基于FinFET和CMOS绝热ECRL技术的比较分析

Gautam Rana, K. Sharma, Anjali Sharma
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引用次数: 0

摘要

实现绝热逻辑电路的低功耗和低延迟是CMOS技术的挑战。本研究提出了一种基于2:1 MUX绝热高效电荷回收逻辑(ECRL)技术,采用FinFET 18nm技术设计。并与CMOS 2:1 MUX进行了比较分析。本文从平均功耗、传播延迟、功率延迟积(PDP)和能量延迟积(EDP)等方面对2:1 MUX进行了进一步的参数分析。在0.5 V、0.7 V、0.9 V和1下分析了所有考虑的参数。1 v。结果表明,ECRL在1.1V时的PDP为$4.05\乘以10^{-15}$J,在0.9 V时为$0.27\乘以10^{-15}$J,在0.7 V时为$1.02\乘以10^{-15}$J,在0.5 V时为$0.51\乘以10^{-15}$J,而在1.1V时的EDP为$0.15\乘以10^{-22}$ J,在0.9 Vis时为$0.01\乘以10^{-22}$ J,在0.7 Vis时为$0.03\乘以10^{-22}$ J,在0.5 V时为$0.02\乘以10^{-22}$ J。本文报道的ECRL技术基础d2:1 MUX在未来可能用于生物医学应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Comparative Analysis of FinFET and CMOS based Adiabatic ECRL Technique
Achieving low power consumption along with low delay for adiabatic logic circuits is challenging in CMOS technology. This study has presented an adiabatic Efficient Charge Recovery Logic (ECRL) technique based 2:1 MUX designed using FinFET 18 nm technology. A comparative analysis of the design has been performed with CMOS 2:1 MUX. Further parametric analysis of 2:1 MUX is performed in terms of average power dissipation, propagation delay, Power Delay Product (PDP), and Energy Delay Product (EDP) are presented in this work. All considered parameters have been analyzed for 0.5 V, 0.7 V, 0.9 V, and 1. 1V. The results show that the PDP of ECRL at 1.1V is $4.05\times 10^{-15}$J, at 0.9 V is $0.27\times 10^{-15}$J, at 0.7 V is $1.02\times 10^{-15}$J, and at 0.5 V is $0.51\times 10^{-15}$ J. While, the EDP at 1.1V is $0.15\times 10^{-22}$ Js, at 0.9 Vis $0.01\times 10^{-22}$ Js, at 0.7 Vis $0.03\times 10^{-22}$ Js, at 0.5 V is $0.02\times 10^{-22}$ J. The FinFET based 2:1 based ECRL is found to be energy efficient in contrast to CMOS based design. The ECRL technique base d2:1 MUX reported in this work may be used for biomedical applications in the future.
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