在-55/150℃的温度范围内,提出了一种新的bimos工艺中SiGe HBT高频噪声参数提取方法

D. Gloria, S. Gellida, G. Morin
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引用次数: 10

摘要

描述了SiGe HBT的高频(HF)测试结构和参数提取方法,以获得温度范围为-55/150度的高频优点值(Ft, Fmax,最小噪声系数NFmin,最佳源反射系数GammaOPT和噪声等效电阻RN)。S参数的频率范围为45 MHz-110 GHz,噪声参数的频率范围为800 MHz-4 GHz。由于这些结构的衬底损耗低,提出了一种新的快速去嵌入高频噪声测量方法。实验数据表明,由于电子迁移率的演化,随着温度的升高,基电阻、NFmin、GammaOPT、Rn增加,Ft、Fmax降低。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A new extraction method of high frequency noise parameters in the temperature range -55/150 deg. for SiGe HBT in BiCMOS process
High Frequency (HF) test structures for SiGe HBT and a parameter extraction methodology are described to obtain HF merit figures (Ft, Fmax, minimum noise figure NFmin, optimum source reflection coefficient GammaOPT, and noise equivalent resistance RN) in the temperature range -55/150 deg. The frequency range is 45 MHz-110 GHz for S parameters and 800 MHz-4 GHz for noise ones. Thanks to low substrate losses in these structures, a new fast de-embedding method for HF noise measurement is presented. Experimental data show an increase of base resistance, NFmin, GammaOPT, Rn and a decrease of Ft, Fmax with increasing temperatures because of the electron mobility evolution.
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