{"title":"全封装硅微机械压阻式加速度计","authors":"K. Walsh, H. Henderson, G. D. De Brabander","doi":"10.1109/SECON.1992.202430","DOIUrl":null,"url":null,"abstract":"The design and development of a second-generation miniature piezoresistive micromachined accelerometer are presented. Bulk micromachining etching techniques were utilized in the fabrication of the single-crystalline silicon device. The sensor is essentially its own package, consisting of three carefully aligned","PeriodicalId":230446,"journal":{"name":"Proceedings IEEE Southeastcon '92","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-04-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"A fully-packaged silicon micromachined piezoresistive accelerometer\",\"authors\":\"K. Walsh, H. Henderson, G. D. De Brabander\",\"doi\":\"10.1109/SECON.1992.202430\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The design and development of a second-generation miniature piezoresistive micromachined accelerometer are presented. Bulk micromachining etching techniques were utilized in the fabrication of the single-crystalline silicon device. The sensor is essentially its own package, consisting of three carefully aligned\",\"PeriodicalId\":230446,\"journal\":{\"name\":\"Proceedings IEEE Southeastcon '92\",\"volume\":\"33 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1992-04-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings IEEE Southeastcon '92\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SECON.1992.202430\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings IEEE Southeastcon '92","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SECON.1992.202430","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A fully-packaged silicon micromachined piezoresistive accelerometer
The design and development of a second-generation miniature piezoresistive micromachined accelerometer are presented. Bulk micromachining etching techniques were utilized in the fabrication of the single-crystalline silicon device. The sensor is essentially its own package, consisting of three carefully aligned
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
