{"title":"氮化侧壁衬垫nmosfet热载流子降解机理及前景器件设计","authors":"Y. Sambonsugi, T. Sugii","doi":"10.1109/RELPHY.1998.670531","DOIUrl":null,"url":null,"abstract":"We investigated the HC reliability of deep submicron LDD nMOSFETs with nitride sidewalls, and found a unique stress bias dependence of HC degradation under lower stress bias conditions. This means lifetime estimations are inconclusive because of deviations from the empirical law. Moreover, we succeeded in improving HC reliability in nitride sidewall devices by shifting the location of the HC injection.","PeriodicalId":196556,"journal":{"name":"1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Hot-carrier degradation mechanism and promising device design of nMOSFETs with nitride sidewall spacer\",\"authors\":\"Y. Sambonsugi, T. Sugii\",\"doi\":\"10.1109/RELPHY.1998.670531\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We investigated the HC reliability of deep submicron LDD nMOSFETs with nitride sidewalls, and found a unique stress bias dependence of HC degradation under lower stress bias conditions. This means lifetime estimations are inconclusive because of deviations from the empirical law. Moreover, we succeeded in improving HC reliability in nitride sidewall devices by shifting the location of the HC injection.\",\"PeriodicalId\":196556,\"journal\":{\"name\":\"1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173)\",\"volume\":\"37 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RELPHY.1998.670531\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.1998.670531","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Hot-carrier degradation mechanism and promising device design of nMOSFETs with nitride sidewall spacer
We investigated the HC reliability of deep submicron LDD nMOSFETs with nitride sidewalls, and found a unique stress bias dependence of HC degradation under lower stress bias conditions. This means lifetime estimations are inconclusive because of deviations from the empirical law. Moreover, we succeeded in improving HC reliability in nitride sidewall devices by shifting the location of the HC injection.