基于调制脉冲功率磁控溅射技术的簇离子源研制

The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems Pub Date : 2013-04-07 DOI:10.1109/NEMS.2013.6559764

Chuhang Zhang, H. Tsunoyama, Hiroki Akatsuka, Hiroki Sekiya, T. Nagase, A. Nakajima

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引用次数: 0

摘要

研制了一种基于调制脉冲功率(MPP)磁控溅射(MSP)的新型离子源，并进行了集群生产试验。利用MPP-MSP产生了银束和硅束，并用四极杆质谱仪进行了分析。发现银簇阴离子的最大强度可达500 pA，明显高于常规DC-MSP。对于硅簇阳离子，MPP-MSP产生的簇束总离子强度约为DC-MSP产生的簇束总离子强度的3倍。

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Development of cluster ion source based on modulated pulse power magnetron sputtering technique

A new ion source based on modulated pulse power (MPP) magnetron sputtering (MSP) was developed and demonstrated for cluster production. By employing MPP-MSP, both silver and silicon cluster beams were produced and analyzed by a quadrupole mass spectrometer. It is found that the maximum intensity of silver cluster anions reaches 500 pA, which is considerably higher than that with a conventional DC-MSP. For silicon cluster cation, the overall ion intensity of the cluster beam by MPP-MSP is about three times higher than that generated by DC-MSP.

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The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems

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