Guiding template assignment using DSA for cut redistribution of 1d layout

Many semiconductor industries gradually tend to transit from the complex 2D design to a high regularity of 1D gridded design. In this transition process, cut distribution position has become the most important challenge. For more advanced nanometer designs, cuts may be too dense to be printed by 193i lithography. While Directed Self-Assembly (DSA) is outstanding in recent years, it is a great potential option. In this paper, we discuss how to pick the appropriate DSA patterns to make cuts and produce 1D gridded design as the original circuit with the same function. With the assignment of different guiding template, DSA pattern shape and size will follow the assignment. In our experiments, simulated annealing algorithm is applied to pick patterns for the conflict number minimization.