使用分层细化机器学习的高性能光刻热点检测

Duo Ding, A. Torres, F. Pikus, D. Pan
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引用次数: 73

摘要

在真实且不断改进的制造条件下,光刻热点检测面临着几个关键挑战。首先,真正的热点变得越来越少,但在布局后阶段更难修复;其次,必须保持低虚警率,避免后处理热点去除过度和昂贵;第三,全芯片物理验证和优化需要快速的周转时间。为了解决这些问题,我们提出了一种速度超快、保真度高的高性能光刻热点检测流程。它由一组新颖的热点签名定义和具有强大机器学习核、人工神经网络(ANN)和支持向量机(SVM)的分层精炼检测流程组成。我们已经在45nm工艺的实际制造条件下使用工业强度引擎实现了我们的算法,并表明它在热点检测误报率(降低2.4倍至2300X)和模拟运行时间(降低5倍至237X)方面显着优于以前最先进的算法,同时具有相似或略好的热点检测精度。这种在真实制造条件下的高性能光刻热点检测特别适合指导光刻友好型物理设计。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High performance lithographic hotspot detection using hierarchically refined machine learning
Under real and continuously improving manufacturing conditions, lithography hotspot detection faces several key challenges. First, real hotspots become less but harder to fix at post-layout stages; second, false alarm rate must be kept low to avoid excessive and expensive post-processing hotspot removal; third, full chip physical verification and optimization require fast turn-around time. To address these issues, we propose a high performance lithographic hotspot detection flow with ultra-fast speed and high fidelity. It consists of a novel set of hotspot signature definitions and a hierarchically refined detection flow with powerful machine learning kernels, ANN (artificial neural network) and SVM (support vector machine). We have implemented our algorithm with industry-strength engine under real manufacturing conditions in 45nm process, and showed that it significantly outperforms previous state-of-the-art algorithms in hotspot detection false alarm rate (2.4X to 2300X reduction) and simulation run-time (5X to 237X reduction), meanwhile archiving similar or slightly better hotspot detection accuracies. Such high performance lithographic hotspot detection under real manufacturing conditions is especially suitable for guiding lithography friendly physical design.
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