Ji-Seon Paek, Dongsu Kim, Jae-Yeol Han, Younghwan Choo, Jongwoo Lee
{"title":"用于4G LTE和5G NR双连接射频前端的高效RF- pa双芯片电源调制器架构","authors":"Ji-Seon Paek, Dongsu Kim, Jae-Yeol Han, Younghwan Choo, Jongwoo Lee","doi":"10.23919/VLSICircuits52068.2021.9492518","DOIUrl":null,"url":null,"abstract":"This paper presents a two-chip supply modulation architecture for efficient RF power amplification using a fully switched-mode supply modulator (SM) and a linear-assisted hybrid SM to support simultaneous transmission on LTE and 5G bands. The designed fully switched-mode SM consists of a fast buck converter and a slow buck converter, and it achieves 88.2% peak efficiency with a low RX band noise of -140dBm/Hz at the SM output. The designed 5G NR SM, consisting of a class-AB linear amplifier (LA) and an interleaved 3-level buck-boost converter provides a 150-MHz 3-dB bandwidth for tracking the 100-MHz envelope signal. An optimal RF-PA supply deployment using the two SMs efficiently supports multiple RF-PA loads while satisfying the dual transmission requirements of E-UTRAN New Radio Dual-Connectivity (EN-DC) and 5G 100-MHz ET operation.","PeriodicalId":106356,"journal":{"name":"2021 Symposium on VLSI Circuits","volume":"147 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Efficient RF-PA Two-Chip Supply Modulator Architecture for 4G LTE and 5G NR Dual-Connectivity RF Front-End\",\"authors\":\"Ji-Seon Paek, Dongsu Kim, Jae-Yeol Han, Younghwan Choo, Jongwoo Lee\",\"doi\":\"10.23919/VLSICircuits52068.2021.9492518\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a two-chip supply modulation architecture for efficient RF power amplification using a fully switched-mode supply modulator (SM) and a linear-assisted hybrid SM to support simultaneous transmission on LTE and 5G bands. The designed fully switched-mode SM consists of a fast buck converter and a slow buck converter, and it achieves 88.2% peak efficiency with a low RX band noise of -140dBm/Hz at the SM output. The designed 5G NR SM, consisting of a class-AB linear amplifier (LA) and an interleaved 3-level buck-boost converter provides a 150-MHz 3-dB bandwidth for tracking the 100-MHz envelope signal. An optimal RF-PA supply deployment using the two SMs efficiently supports multiple RF-PA loads while satisfying the dual transmission requirements of E-UTRAN New Radio Dual-Connectivity (EN-DC) and 5G 100-MHz ET operation.\",\"PeriodicalId\":106356,\"journal\":{\"name\":\"2021 Symposium on VLSI Circuits\",\"volume\":\"147 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-06-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 Symposium on VLSI Circuits\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/VLSICircuits52068.2021.9492518\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 Symposium on VLSI Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/VLSICircuits52068.2021.9492518","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
摘要
本文提出了一种双芯片供电调制架构,使用全开关模式供电调制器(SM)和线性辅助混合SM来实现有效的射频功率放大,以支持LTE和5G频段上的同时传输。所设计的全开关模式SM由一个快降压转换器和一个慢降压转换器组成,在SM输出端实现了88.2%的峰值效率和-140dBm/Hz的低RX波段噪声。设计的5G NR SM由ab类线性放大器(LA)和交错3电平降压-升压转换器组成,提供150-MHz 3-dB带宽,用于跟踪100-MHz包络信号。使用两个SMs的最佳RF-PA电源部署有效地支持多个RF-PA负载,同时满足E-UTRAN新无线电双连接(EN-DC)和5G 100-MHz ET操作的双传输要求。
Efficient RF-PA Two-Chip Supply Modulator Architecture for 4G LTE and 5G NR Dual-Connectivity RF Front-End
This paper presents a two-chip supply modulation architecture for efficient RF power amplification using a fully switched-mode supply modulator (SM) and a linear-assisted hybrid SM to support simultaneous transmission on LTE and 5G bands. The designed fully switched-mode SM consists of a fast buck converter and a slow buck converter, and it achieves 88.2% peak efficiency with a low RX band noise of -140dBm/Hz at the SM output. The designed 5G NR SM, consisting of a class-AB linear amplifier (LA) and an interleaved 3-level buck-boost converter provides a 150-MHz 3-dB bandwidth for tracking the 100-MHz envelope signal. An optimal RF-PA supply deployment using the two SMs efficiently supports multiple RF-PA loads while satisfying the dual transmission requirements of E-UTRAN New Radio Dual-Connectivity (EN-DC) and 5G 100-MHz ET operation.