{"title":"接键顺序对GMR静电防护的影响","authors":"F.G. Zhao, R. Tao, Hong Tian","doi":"10.1109/EOSESD.2000.890046","DOIUrl":null,"url":null,"abstract":"One of the key issues for ESD protection in the GMR head gimbal assembly (HGA) and head stack assembly (HSA) processes is how to prevent \"metal contact\", i.e. the direct contact of the GMR sensor to metal. This paper describes a very effective method for better ESD protection in the HGA and HSA processes where the \"metal contact\" cannot be avoided.","PeriodicalId":332394,"journal":{"name":"Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2000-09-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"The effect of bonding sequence on GMR ESD protection\",\"authors\":\"F.G. Zhao, R. Tao, Hong Tian\",\"doi\":\"10.1109/EOSESD.2000.890046\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"One of the key issues for ESD protection in the GMR head gimbal assembly (HGA) and head stack assembly (HSA) processes is how to prevent \\\"metal contact\\\", i.e. the direct contact of the GMR sensor to metal. This paper describes a very effective method for better ESD protection in the HGA and HSA processes where the \\\"metal contact\\\" cannot be avoided.\",\"PeriodicalId\":332394,\"journal\":{\"name\":\"Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-09-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EOSESD.2000.890046\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Overstress/Electrostatic Discharge Symposium Proceedings 2000 (IEEE Cat. No.00TH8476)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EOSESD.2000.890046","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The effect of bonding sequence on GMR ESD protection
One of the key issues for ESD protection in the GMR head gimbal assembly (HGA) and head stack assembly (HSA) processes is how to prevent "metal contact", i.e. the direct contact of the GMR sensor to metal. This paper describes a very effective method for better ESD protection in the HGA and HSA processes where the "metal contact" cannot be avoided.