用于芯片间数据帧传输的帧封隔器设计

2022 IEEE 6th Advanced Information Technology, Electronic and Automation Control Conference (IAEAC ) Pub Date : 2022-10-03 DOI:10.1109/IAEAC54830.2022.9929540

Yuzhe Chen, Yubo Wang, Dejian Li, Changzheng Dong, Jie Gan, Jinlong Pan

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引用次数: 0

摘要

本文介绍了一种用于数据帧协议传输的帧封装器的设计，它可以应用于芯片之间的数据交互。通过本文设计的帧封隔器，可以将芯片A中的测量值转换成符合传输协议的数据帧格式，并通过SPI实现芯片A与芯片B之间的数据传输。采用该框架封装器设计的单片机已经通过了VCS和FPGA的验证。芯片已成功地用胶带粘住了。样品的测试结果表明，框架封隔器的功能设计是有用的，性能良好。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Design of A Frame Packer for Data FrameTransmission between Chips

This paper introduces the design of a frame packer for the transmission of data frame protocol, which can be applied to the interaction of data between chips. Through the frame packer designed in this paper, the measurement value in chip A can be transformed into the format of data frame which can be in accordance with the transmission protocol, and the data transmission between chip A and chip B can be realized through SPI. The MCU chip with this frame packer design has passed verification by VCS and FPGA. The chip has been successfully taped out. The test results of the samples show that the function design of the frame packer is useful and the performance is good.

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来源期刊

2022 IEEE 6th Advanced Information Technology, Electronic and Automation Control Conference (IAEAC )

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