合金元素S、Se、Te对Cu合金573 ~ 873 K抗氧化性能的影响

Liu Guojun, Y. Zhu, K. Mimura, M. Isshiki
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引用次数: 3

摘要

在573 ~ 873 K的0.1 MPa纯氧气氛中,以6N (99.9999 wt.%) Cu为对照,研究了合金元素S、Se、Te对纯Cu抗氧化性能的影响。结果表明,添加S、Se或Te能显著提高Cu的抗氧化性。这种改善是由于Cu2O/Cu界面处合金元素的积累和Cu2O晶界处合金元素的偏析造成的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effect of Alloying Element of S, Se or Te on Oxidation Resistance of Cu at 573-873 K
The influence of alloying element S, Se or Te on the oxidation resistance of pure Cu was studied by oxidizing in 0.1 MPa pure oxygen atmosphere at 573-873 K in comparison with a 6N Cu (99.9999 wt.%). The addition of S, Se or Te is found to improve the oxidation resistance of Cu remarkably. This improvement is contributed from the accumulation of alloying element at the Cu2O/Cu interface and segregation of alloying elements at grain boundaries in Cu2O.
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