双工作功能全硅化金属闸门

C. Cabral, J. Kedzierski, B. Linder, S. Zafar, V. Narayanan, S. Fang, A. Steegen, P. Kozłowski, R. Carruthers, R. Jammy
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引用次数: 35

摘要

利用Sb预掺杂的多晶硅材料制备了全硅化(FUSI)、双功函数(WF)、Ni单硅化金属栅极,并首次采用Al预掺杂的多晶硅材料和Ni(Pt)合金硅化材料制备了fet WF。Sb和Al预掺杂的多晶硅与Ni(Pt)Si的结合,允许WFs跨越Si带隙到带边缘的0.2 eV以内。具有如此大的WF范围,FUSI,双WF, NiSi工艺适用于高性能和低功耗CMOS应用。结果表明,Al和Sb预掺杂的多晶硅和Ni(Pt)Si合金具有与本构多晶硅形成的NiSi相当的泄漏电流。在CoSi/sub - 2/金属栅极形成过程中存在一个基本的空洞问题,表明了NiSi栅极的优越性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Dual workfunction fully silicided metal gates
Fully silicided (FUSI), dual workfunction (WF), Ni monosilicide metal gates are demonstrated using Sb predoped polySi for setting the nFET WF and for the first time a combination of Al predoped polySi and a Ni(Pt) alloy silicide for the pFET WF. The combination of the Sb and Al predoped polySi along with the Ni(Pt)Si, allow for WFs spanning the Si band gap to within 0.2 eV of the band edges. With this large WF range the FUSI, dual WF, NiSi process is applicable for both high performance and low power CMOS applications. It is shown that the Al and Sb predoped polySi and the Ni(Pt)Si alloy have leakage currents equivalent to NiSi formed from intrinsic polySi. A fundamental voiding problem in the formation of CoSi/sub 2/ metal gates is also demonstrated, indicating the superiority of the NiSi gates.
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