基于CNTFET互连线寄生元件的CS放大器分析

Marani Roberto, Gina Perri Anna
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引用次数: 0

摘要

在本文中,我们提出了一种方法来研究嵌入碳纳米管的集成电路中互连线的寄生元件(电容、电感和电阻)的影响。特别分析了碳纳米管的漏极/源极衬垫尺寸,以及碳纳米管与适当负载之间的互连线的尺寸。为了估计碳纳米管嵌入式集成电路中的寄生元件,我们分析了50纳米技术。此外,还可以对10纳米和3纳米技术进行预测分析。我们将所提出的方法应用于共源放大器的设计,使用我们已经提出的CNTFET模型。使用ADS模拟器获得的频域仿真显示了寄生元件如何限制碳纳米管的性能。特别地,我们得到了被检查的充满寄生元件的放大器的- 3db切割频率随着技术的降低而增加。此外,我们使用SPICE重复提出的模拟,得到的结果几乎一致,但与Verilog-A实现相比,我们的模拟运行时间要短得多,软件也要简洁明了得多。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Analysis of a CS amplifier Based on CNTFET with parasitic elements of interconnection lines
In this paper we present a procedure to study the effects of parasitic elements (capacitances, inductances and resistances) of interconnection lines in integrated circuits where Carbon Nanotubes are embedded. In particular the Drain/Source pads dimensions of CNT are analysed, as well as the interconnection lines between a CNT and an appropriate load are sized. In order to estimate parasitic elements in CNTs embedded integrated circuits, we analyse 50 nm technology. Moreover it is also possible for predictions analysis on 10 nm and 3 nm technology. We apply the proposed procedure to the design of a Common-Source amplifier, using a CNTFET model already proposed by us. The frequency domain simulations, obtained using the ADS simulator, show how the parasitic elements limit the performances of CNTs. In particular we obtain that the -3 dB cutting frequency of the examined amplifier full of parasitic elements increases as technology decreases. Moreover we repeat the proposed simulations using SPICE, obtaining results practically coincident but with the Verilog-A implementation we have mainly a simulation run time much shorter and a software much more concise and clear than schemes using ABM blocks in SPICE.
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