碳化硅器件SPICE模型的参数估计

2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Pub Date : 2017-09-01 DOI:10.23919/EMPC.2017.8346918

D. Bisewski

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引用次数: 4

摘要

研究了半导体器件中内置SPICE模型的参数估计问题。提出并讨论了一种新的基于遗传算法的参数估计方法。通过对所选碳化硅半导体器件的测量结果和SPICE模型的仿真，说明了所提方法的有效性和准确性。

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Parameters estimation of SPICE models for silicon carbide devices

The paper deals with the problem of parameters estimation of built-in in SPICE models of semiconductor devices. A new parameters estimation procedure based on the genetic algorithm is proposed and discussed. The usefulness and accuracy of presented procedure are illustrated by means of the results of measurements and SPICE models simulations for selected semiconductor devices made of silicon carbide.

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2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition

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